Additionally, it’s reported that the iWatch will be built using SiPs (System-in-Package modules) rather than PCBs (Printed Circuit Boards), meaning that the iWatch’s processor, memory, storage, and other components will likely be wrapped up into a single package.
Kinsus Interconnect Technology Corp, NanyaPCB and ASE Group (a.k.a. Advanced Semiconductor) are said to be the ones responsible for the production of the SiP modules.
Supply chain sources are expecting shipments of 2.5 to 3 million units in Q2. Production is said to ramp up to 14-15 million units for Q3.
A recent report from KGI Securities analyst Ming Chi Kuo has Apple producing the iWatch in 1.3-inch and 1.5-inch sizes to accommodate different sized wrists. Both are said to utilize flexible AMOLED displays with sapphire glass covers for scratch protection. The device will reportedly integrate numerous biometric sensors, a NFC chip, and have a slim, light, ‘fashionable appearance’.